APPLICATIONS
BOPP Material
BOPP is a cost-effective material, mainly suitable for large-scale, low-cost production scenarios where the requirement for precision is not extremely high. It has excellent demolding performance due to its low surface energy, which makes it naturally not easy to stick to the mold during the molding process, without additional demolding treatment, thus improving production efficiency.
In terms of processing performance, BOPP requires 30-40% less energy for heat sealing than PET, enabling faster processing speed and lower production costs, which is its most prominent advantage. Its microstructure replication accuracy is high (micro-scale), but the edge of the replicated microstructures is slightly blurred, which is not suitable for nano-scale precision applications.
There are also some limitations in the application of BOPP. Its thermal shrinkage rate is relatively high (2-3%), and it is prone to deformation during high-temperature molding, which restricts its application in high-precision scenarios. In addition, its surface energy is low (30-34mN/m), so it must undergo strong corona treatment (surface energy ≥42mN/m) or priming before UV molding; otherwise, the adhesion of UV glue will be poor, leading to the detachment of microstructures. Its heat resistance is general, and the continuous service temperature should not exceed 80℃.
